4. MODULE FEATURES

This page describes the COM module features

4.1 cExpress-WL 8665UE module

The cExpress-WL module from ADLINK is compact size type 6 module with form factor 95mm x 95mm. cExpress-WL module features quad/dual core 8th gen Intel® core processors and supports upto 64GB non-ECC DDR4 memory on two SODIMM sockets.

Following summarizes key features and specifications of cExpress-WL type 6 module.

Module

Specification

CPU

Core™ i7-8665UE, 1.7 (4.4 Turbo) GHz, 8MB, 15W (25W-12.5W cTDP), 4C/GT2

Audio Chipset and Codec

Intel HD Audio integrated into SoC; On Carrier Express-BASE6. Standard Support for ALC886

Ethernet and Interface

Intel MAC/PHY; Intel I219-LM/V (LM supports AMT 12.x); 10/100/1000 Mbit/s Connection

Display

Intel Generation 9 LP Graphics Core Architecture. Supports 3 Independent and Simultaneous Display Combinations of DisplayPort/HDMI/LVDS, eDP or VGA Outputs

Two DDI Channels, One LVDS, Optional: 4 Lanes eDP, Optional: One VGA

Expansion Busses

6 PCI Express x1 Gen3 (AB): Lanes 0/1/2/3/4/5 (configurable to x2, x4)

2 PCI Express x1 Gen3 (CD): Lanes 6/7

1 PCI Express x1 Gen3 (CD): Lane 16 Muxed with SATA Port 3, by Build Option

NOTE: Supports 5 PCIe Devices LPC Bus, SMBus (System), I2C (User)

eMMC Chip

5.0 (8/16/32GB by Build Option)

Memory

Up to 64GB Dual Channel Non-ECC DDR4 at 2133/2400MHz in Two SODIMM Sockets

SATA Ports

3x SATA 6Gb/s (SATA 0,1,2), SATA Port 3 Muxed with PCIe Lane 16

NOTE: SATA Port 3 is the Default Setting.

USB Ports

4x USB 3.1 Gen 2/2.0/1.1 (USB 0, 1, 2, 3) and 4x USB 2.0/1.1 (USB 4, 5, 6, 7)

Mechanical, Electrical, and Environmental Specifications

Form-Factor

H 3.74” x W 3.74” (95 mm x 95 mm): PICMG COM.0: Rev 3.0 Type 6; Compact

Power Consumption

15 Watts

Standard Input: ATX: 12V ±5% / 5Vsb ±5%; or AT: 12V±5%

Wide Input: ATX: 5-20 V / 5Vsb ±5%; or AT: 5-20V

Management: ACPI 5.0 Compliant, Smart Battery Support

Power States: C1-C6, S0, S1, S3, S4, S5, S5 ECO Mode (Wake on USB S3/S4, WoL - Wake-on-LAN S3/S4/S5) ECO Mode: Support Deep S5 Mode for Power Saving

Temperature Range at Module Thermal Transfer Plate (TTP)

-40°C to +85°C (-40°F to +185°F)

Extreme Rugged Optional : -45°C to + 185°C on Selected SKUs

Cooling Mechanism

Conduction Cooling

Humidity

5-90% RH Operating, Non-Condensing

5-95% RH Storage and Operating with Conformal Coating

Shock and Vibration

IEC 60068-2-64 and IEC-60068-2-27

MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D

HALT (Highly Accelerated Life Test)

Thermal Stress, Vibration Stress, Thermal Shock and Combined Test

4.2 COM Express Type 6 connectors

The following figure depicts the COM Express Type 6 connector layout.

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