4. MODULE FEATURES
This page describes the COM module features
The cExpress-WL module from ADLINK is compact size type 6 module with form factor 95mm x 95mm. cExpress-WL module features quad/dual core 8th gen Intel® core processors and supports upto 64GB non-ECC DDR4 memory on two SODIMM sockets.
Following summarizes key features and specifications of cExpress-WL type 6 module.
Module | Specification |
CPU | Core™ i7-8665UE, 1.7 (4.4 Turbo) GHz, 8MB, 15W (25W-12.5W cTDP), 4C/GT2 |
Audio Chipset and Codec | Intel HD Audio integrated into SoC; On Carrier Express-BASE6. Standard Support for ALC886 |
Ethernet and Interface | Intel MAC/PHY; Intel I219-LM/V (LM supports AMT 12.x); 10/100/1000 Mbit/s Connection |
Display | Intel Generation 9 LP Graphics Core Architecture. Supports 3 Independent and Simultaneous Display Combinations of DisplayPort/HDMI/LVDS, eDP or VGA Outputs |
| Two DDI Channels, One LVDS, Optional: 4 Lanes eDP, Optional: One VGA |
Expansion Busses | 6 PCI Express x1 Gen3 (AB): Lanes 0/1/2/3/4/5 (configurable to x2, x4) 2 PCI Express x1 Gen3 (CD): Lanes 6/7 1 PCI Express x1 Gen3 (CD): Lane 16 Muxed with SATA Port 3, by Build Option NOTE: Supports 5 PCIe Devices LPC Bus, SMBus (System), I2C (User) |
eMMC Chip | 5.0 (8/16/32GB by Build Option) |
Memory | Up to 64GB Dual Channel Non-ECC DDR4 at 2133/2400MHz in Two SODIMM Sockets |
SATA Ports | 3x SATA 6Gb/s (SATA 0,1,2), SATA Port 3 Muxed with PCIe Lane 16 NOTE: SATA Port 3 is the Default Setting. |
USB Ports | 4x USB 3.1 Gen 2/2.0/1.1 (USB 0, 1, 2, 3) and 4x USB 2.0/1.1 (USB 4, 5, 6, 7) |
Mechanical, Electrical, and Environmental Specifications | |
Form-Factor | H 3.74” x W 3.74” (95 mm x 95 mm): PICMG COM.0: Rev 3.0 Type 6; Compact |
Power Consumption | 15 Watts Standard Input: ATX: 12V ±5% / 5Vsb ±5%; or AT: 12V±5% Wide Input: ATX: 5-20 V / 5Vsb ±5%; or AT: 5-20V Management: ACPI 5.0 Compliant, Smart Battery Support Power States: C1-C6, S0, S1, S3, S4, S5, S5 ECO Mode (Wake on USB S3/S4, WoL - Wake-on-LAN S3/S4/S5) ECO Mode: Support Deep S5 Mode for Power Saving |
Temperature Range at Module Thermal Transfer Plate (TTP) | -40°C to +85°C (-40°F to +185°F) Extreme Rugged Optional : -45°C to + 185°C on Selected SKUs |
Cooling Mechanism | Conduction Cooling |
Humidity | 5-90% RH Operating, Non-Condensing 5-95% RH Storage and Operating with Conformal Coating |
Shock and Vibration | IEC 60068-2-64 and IEC-60068-2-27 |
| MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D |
HALT (Highly Accelerated Life Test) | Thermal Stress, Vibration Stress, Thermal Shock and Combined Test |
The following figure depicts the COM Express Type 6 connector layout.
COMexpress Type6 feaures
Last modified 2yr ago