3. JETSON MODULE TECHNICAL SPECIFICATION
Below is a high level summary of Jetson module features. Please visit nvidia.com or search online for more complete information on the Jetson Nano, Xavier NX and TX2 NX CPU Modules.
Feature | Description | ||
Processing | |||
AI Performance | 472 GFLOPs @ 10 W | 14 TOPS (INT8) @ 10 W 21 TOPS (INT8) @ 15 W | 1.33 TFLOPS |
SoC | NVIDIA Tegra X1 Series | NVIDIA Xavier | |
GPU | NVIDIA Maxwell Architecture with 128 NVIDIA CUDA® Cores @ 921MHz 0.5 TFLOPs (FP16) | 384-core NVIDIA Volta™ GPU with 48 Tensor Cores | 256-core NVIDIA Pascal™ GPU |
CPU | 64-bit Quad-core ARM A57 @ 1.43GHz Quad-core ARM Cortex®-A57 CPU Complex | 6-core NVIDIA Carmel 6-Core Arm® v8.2 64-bit CPU, 6 MB L2 + 4 MB L3 | Dual-Core NVIDIA Denver 2 64-Bit CPU and Quad-Core Arm® Cortex®-A57 MPCore processor |
Deep Learning Accelerator | – | (2x) NVIDIA Deep Learning Accelerator (NVDLA) Engines | – |
Memory | 4GB 64-bit LPDDR4 @ 1600MHz, 25.6 GB/s | 8 GB 128-bit LPDDR4x @ 1600 MHz, 51.2GB/s | 4 GB 128-bit LPDDR4@1600MHz 51.2GB/s |
Video Encode | 4Kp30 | (4x) 1080p30 | (2x) 1080p60 (HEVC) 50MP/Sec 1x 4K @ 30 (HEVC) 2x 1080p @ 60 (HEVC) 4x 1080p @ 30 (HEVC); 4x 720p @ 6 (HEVC) 9x 720p @ 30 (HEVC) | 2x 464MP/Sec (HEVC) 2x 4K @ 30 (HEVC) 6x 1080p @ 60 (HEVC) 14x 1080p @ 30 (HEVC) | 1x 4K60 3x 4K30 4x 1080p60 8x 1080p30 (H.265) 1x 4K60 3x 4K30 7x 1080p60 14x 1080p30 (H.264) |
Video Decode | 4Kp60 | (2x) 4Kp30 | (8x) 1080p30 | (4x) 1080p60, 500MP/sec 1x 4K @ 60 (HEVC) 2x 4K @ 30 (HEVC) 4x 1080p @ 60 (HEVC) 8x 1080p @ 30 (HEVC) 9x 720p @ 60 (HEVC) | 2x 690MP/sec (HEVC) 2x 4K @ 60 (HEVC) 4x 4K @ 30 (HEVC) 12x 1080p @ 60 (HEVC) 16x 1080p @ 30 (H.264) 32x 1080p @ 30 (HEVC) | 2x 4K60 4x 4K30 7x 1080p60 14x 1080p30 (H.265 & H.264) |
Vision Accelerator | – | 7-way VLIW Processor | – |
Interfaces | |||
Camera Expansion Header | Up to 4 Cameras 12 Lanes (3 x 4 or 4 x 2) MIPI CSI-2 D-PHY 1.1 (1.5 Gb/s Per Pair) | Up to 6 Cameras (24 via Virtual Channels) 12 Lanes MIPI CSI-2 D-PHY 1.2 (Up to 30 Gbps) | Up to 5 cameras (12 via virtual channels) 12 lanes MIPI CSI-2 D-PHY 1.1 (up to 30 Gbps) |
Connectivity | Wi-Fi (Requires External Chip) 1 Gigabit Ethernet, M.2 Key E | 1 Gigabit Ethernet, MAC, Reduced Gigabit Media Independent (RGMII) Interface | 1 Gigabit Ethernet |
Display | HDMI 2.0, DisplayPort eDP 1.4 | 2 Multi-Mode DP 1.4/eDP 1.4/HDMI 2.0 | 2 multi-mode DP 1.2/eDP 1.4/HDMI 2.0 |
Miscellaneous I/O's | (3x) I2C | (2x) SPI | UART | I2S | GPIOs, I2S, | UFS, I2S, I2C, SPI, CAN, GPIOs, UART, SD | (4x) I2C | (2x) SPI | UART | I2S | GPIOs I2S, CAN, SDIO |
Networking | 10/100/1000 BASE-T Ethernet | 10/100/1000 BASE-T Ethernet | 10/100/1000 BASE-T Ethernet |
PCIe | 1 x4 (PCIe Gen2) | 1 x1 (PCIe Gen3) + 1 x4 (PCIe Gen4), Total 144 GT/s* (PCIe Gen3, Root Port & Endpoint) | 1 x2 and 1 x1 PCIe |
Storage | 16 GB eMMC 5.1 MicroSD Card (16GB UHS-1 Recommended Minimum) | 16 GB eMMC 5.1 | 16 GB eMMC 5.1 |
USB | 1x USB 3.0, 3x USB 2.0 | 1x USB 3.1, 3x USB 2.0 | 1x USB 3.0, 3x USB 2.0 |
Miscellaneous I/O's | GPIO, I2S, i2c, SPI, UART | GPIO, I2S, i2c, SPI, UART | GPIO, I2S, i2c, SPI, UART |
Mechanical, Electrical, and Environmental Properties | |||
Form-Factor | L 2.74” X W 1.77" (69.6 mm x 45 mm) | L 2.74” X W 1.77" (69.6 mm x 45 mm) | L 2.74” X W 1.77" (69.6 mm x 45 mm) |
Connector | 260-Pin SO-DIMM Connector | 260-Pin SO-DIMM Connector | 260-Pin SO-DIMM Connector |
Cooling Solution | Heat sink / fan sink available | Heat sink / fan sink available | Heat sink / fan sink available |
Voltage Input | 5V | 5V | 5V |
Power Input Range | 5W / 10W | 10W / 15W | 10W / 15W |
Ambient Operating Temperature Range | -20°C to 70°C | -20°C to 70°C | -20°C to 70°C |
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